PCB size and panelization strategy

 

PCB size and efficient panelization are of great significance in cost management, especially in mass production.

 

  • Panel efficiency: Maximizing the number of boards on a single panel can improve material utilization and reduce unit cost. Adopting a unified rectangular design helps optimize panel utilization and minimize waste.
  • Material and thickness limitations: Some materials (such as Rogers laminates) have specific panel size limitations. Board thickness affects panel spacing. Thicker boards require more space between units, which may reduce the output of each panel.
  • Edge features and component overhang: If there are edge connectors (such as gold fingers) or components that extend beyond the edge of the circuit board in the design, additional space is required on the panel, thereby reducing panel efficiency. Relocating components or modifying connector designs can help save panel space.

 

When designers optimize PCB size, panel arrangement, and layout, they can increase material output and reduce the cost of each circuit board. The effect is particularly significant in mass production. Adjusting edge features, thickness, and component positioning can further improve panel utilization and reduce waste.

 

Layer optimization and stack-up design

 

The number of layers directly affects production complexity and cost. Simplifying the stack can optimize layer usage and reduce cost.

 

  • Merging signal layers: Effectively combining signal paths on fewer layers can reduce the number of layers, material and labor costs, and minimize manufacturing complexity.
  • Thermally stable stack: High-frequency applications require symmetric stacking to ensure thermal stability. However, for general applications, asymmetric stacking can reduce material usage and cost without affecting reliability.
  • Minimize additional processing steps: By merging layers and optimizing wiring, designers can reduce lamination cycles and bonding steps to achieve simpler and faster manufacturing.

 

Reducing unnecessary layers and integrating signals can improve cost-effectiveness and production efficiency. Selecting the correct stacking method according to the thermal and signal requirements of each application can ensure optimal performance while minimizing complexity and material usage.

 

Reducing design complexity to improve manufacturability

 

Highly complex designs, although sometimes indispensable, increase production costs. Simplifying design elements as much as possible can improve manufacturing feasibility.

 

  • Reducing high-density features: Minimize the use of microvias and dense hole layouts to reduce the need for laser drilling and additional inspections, thereby reducing costs.
  • Avoiding custom shapes: Non-standard board shapes are difficult to panelize efficiently and usually require custom wiring, which increases production costs. Choosing standard shapes can improve panel utilization.
  • Standardizing via types: Adhering to common via types (such as avoiding blind or buried vias) can reduce the need for specialized drilling equipment and inspections and simplify production.

 

By limiting complex design features such as microvias, complex shapes, and custom holes, designers can reduce the need for advanced equipment and processes, ultimately reducing manufacturing costs and increasing production output.

 

Optimizing line width and spacing

 

Line width and spacing affect manufacturability and production cost. Design adjustments can reduce etching complexity and increase production output.

 

  • Using standard line widths: Standard line widths simplify the etching process and reduce inspection requirements, thereby reducing costs. Although strict tolerances are sometimes required, they should be minimized to reduce production difficulty.
  • Reducing conductor density: High-density wiring requires advanced etching technology and increases inspection time. Avoiding wiring congestion can simplify production and improve quality control efficiency.
  • Widening spacing as much as possible: Ensuring sufficient spacing between traces reduces the risk of short circuits, simplifies the etching process, and reduces the possibility of rework.

 

Standardizing line widths and spacings and avoiding high-density wiring can reduce etching complexity and inspection requirements, reducing costs and improving manufacturability without affecting circuit functionality.

 

Hole size and quantity: Efficient via management

 

Hole requirements (including quantity, type, and size) affect drilling cost and time. Optimizing these factors can simplify manufacturing.

 

  • Standardizing hole sizes: Using uniform hole sizes reduces tool change frequencies and improves drilling efficiency. Minimizing size variations simplifies production and reduces material costs.
  • Minimizing microvias: Due to the high precision of laser drilling, microvias are more costly. Designers can give priority to using through holes for non-critical connections to control costs.
  • Reducing drilling density: Reducing drilling density reduces drilling time and related costs. Optimizing drilling positions and quantities can minimize material and labor costs.

 

Efficient via management helps control drilling costs and is a key factor in high-density or multi-layer designs.