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Tg Definition:
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Tg stands for Glass Transition Temperature. As printed circuit boards (PCBs) are
classified as V-0 (UL 94-V0) for flammability, if the temperature exceeds the
designated Tg value, the board will transition from a glassy state to a rubbery
state, thereby affecting the PCB’s functionality.
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| Working Temperature Considerations: |
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If your product’s operating temperature is higher than normal (130-140°C), you
need to use high Tg material, which is >170°C. Common high Tg values for PCBs
are 170°C, 175°C, and 180°C. Typically, the PCB Tg value should be at least
10-20°C higher than the product’s working temperature. For example, if you use a
130 Tg board, the working temperature should be lower than 110°C; for a 170 Tg
board, the maximum working temperature should be lower than 150°C.
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| Differences Between Tg 130 and Tg 170: |
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To understand the differences between Tg 130 and Tg 170, please continue reading.
Additionally, we have provided specifications for Tg 150 and Tg 170 to help
customers better understand high Tg materials. For more information, read the
comparisons: Tg 150 vs. Tg 170.
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| Popular High Tg Board Materials: |
Here are some popular high Tg board materials available in the market:
- S1170 & S1000-2: SYL (Shengyi Technology)
- FR406, FR408, IS410 & DS370HR: Isola
- MCL-E-679: Hitachi
- N4000-6 & N4000-11: Nelco
There are many different high Tg materials not listed here. Different countries
and companies may prefer different materials. Please refer to the datasheets for
each material to choose the most suitable one for your needs. If not specified,
we typically use S1170 from SYL.
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| High Tg Materials in the LED Industry: |
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170 Tg raw materials are also popular in the LED industry because the heat
dissipation of LEDs is higher than that of normal electronic components. The
same structure of FR4 boards is much cheaper than MCPCBs or Ceramic boards. The
normal Tg value of MCPCBs is the same as standard FR4 PCBs, at 130-140°C.
Customers can also request high Tg (170-180°C) for MCPCBs, but the thermal
conductivity will only be (0.3-0.4 W/m.K).
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| For Extremely High Temperatures: |
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If the PCB’s working temperature is higher than 170/180°C, such as 200°C, 280°C,
or even higher, it is advisable to use a Ceramic board, which can withstand
temperatures ranging from -55°C to 880°C.
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High Frequency PCB Technics Capacity
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No.
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Item
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Description
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DataSheet
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1
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Rogers Material |
RO3000 Series
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RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210 |
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2
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Rogers Material |
RO4000 Series
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RO4003C, RO4350B, RO4360, RO4533, RO4700, RO4835 |
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3
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Rogers Material |
RT5000 Series
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RT5870, RT5880 |
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4
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Rogers Material |
RT6000 Series
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RT6002, RT6035, RT6006 |
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5
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Rogers PP |
Semi-cured adhesive
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RO4403(4mil), RO4450B(4mil), RO4450F(4mil), RO3001(1.5mil), RO2929
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6
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Arlon Material |
Arlon Series
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Diclad, Cuclad, Isoclad, AD Series, CLTE eles |
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7
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Arlon PP |
Semi-cured adhesive
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25FR 1080(4mil), 25FR 2112(6mil), Cuclad6700(1.5mil) |
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8
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Taconic Material |
Taconic Series
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TLX, TLY, RF, TLC, TLG Series, CER10 eles |
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9
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Taconic PP |
Semi-cured adhesive
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TP-32(4mil), TPG(4mil), HT1.5(1.5mil) |
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10
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Wangling Material |
Wangling
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F4BK, F4BM, F4B, TP-1/2, TF-1/2, CT330, CT350, CT440, CT615 |
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11
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Finish copper thickness |
OZ
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0.50Z-120Z |
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12
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Material copper thickness |
OZ
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0.50z-10Z |
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13
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Min finish board size |
All Material
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0.5*1.0mm |
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14
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The number of layers |
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1-70layers |
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15
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High Frequerncy mixed pressure layers |
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4-70layers |
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16
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Material mixed pressure |
Variety
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Rogers/Taconic/Arlon/Wanglin and FR-4 |
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17
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Min core thickness |
mil
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4mil |
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18
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Max finish board size |
RO3000 Series
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590*440mm(Single/Double Side), 580*420mm(Multi-layers) |
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RO4000 Series
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1200*430mm(Single/Double Side), 880*600mm(Multi-layers) |
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RT5000 Series
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590*440mm(Single/Double Side), 580*420mm(Multi-layers) |
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RT6000 Series
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590*440mm(Single/Double Side), 580*420mm(Multi-layers) |
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F4BM Series
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1480*430mm(Single/Double Side) |
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TP/TF Series
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180mm*180mm(Single/Double Side) |
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CT Series
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1200*430mm(Single/Double Side), 880*600mm(Multi-layers) |
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19
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Max PTFE array size(thicknesss 0.50mm) |
mm
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16*18 |
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20
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Finish board thickness |
mm
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0.13-8.0mm(Double Side) 0.4-8.0mm(Multi-Layers) |
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21
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Min PTFE material hole size |
mm
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0.35 |
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22
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Dielectric constant |
Range
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1-25 |
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23
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Material thickness tolerance |
mm
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±0.05mm |
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24
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Finish board thickness tolerance |
mm
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Board thickness≤1.0mm:±0.1, Board thickness>1.0mm:±10% |
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25
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Min Pattern Width tolerance |
um
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±20um |
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26
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Min Pattern Width/Spacing |
mm
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0.076mm |
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Please contact us for more information about
Hi Tg
circuit board.
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