RF Board

RF boards, or Radio Frequency Printed Circuit Boards, are designed specifically
for applications operating at high frequencies, typically between 300 MHz to 3
GHz or even higher. Standard FR4 boards cannot meet the stringent requirements
for high-frequency performance, necessitating the use of special materials to
achieve optimal performance.

RF boards excel in high-frequency performance due to their low dielectric
tolerance and material loss. They are ideal for applications where precise
signal transmission and minimal loss are critical.

• Currently, the following materials are commonly used for RF boards:
• Rogers High-Frequency Circuit Materials: These include
  variants like
  RO4233, RO4350, RO4003, etc., with copper thickness ranging from 1/4 OZ
  to 2
  OZ. These materials are renowned for their excellent high-frequency
  characteristics.
• PTFE (Dupon Telfon): Known for its low dielectric
  constant and loss
  tangent, PTFE is suitable for high-frequency applications where signal
  integrity is paramount.

While the fabrication process is similar to that of FR4 boards, RF boards require
more intricate copper plating due to the characteristics of the materials used.
Metalizing through-holes (copper plating) is more challenging, and other
processes are more complex compared to FR4. Therefore, specialized handling
methods and experienced workers are essential for producing high-quality RF
boards.

RF boards play a crucial role in modern electronics, enabling reliable
high-frequency signal transmission. Their use of specialized materials and
fabrication processes ensures optimal performance in demanding applications
across various industries.

• Material:
• Rogers/Teflon
• Board Thickness:
• 0.5mm~3.0mm (0.02″~0.12″)
• Copper Thickness:
• 0.5 oz, 1.0 oz, 2.0 oz, 3.0 oz
• Outline:
• Routing, punching, V-Cut
• Soldermask:
• White, Black, Blue, Green, Red Oil
• Legend/Silkscreen Color:
• Black, White
• Surface Finishing:
• Immersion Gold, HASL, OSP
• Max Panel Size:
• 600*500mm (23.62″*19.68″)
• Packing:
• Vacuum/Plastic bag
• Samples Lead Time (L/T):
• 7~9 Days
• Mass Production Lead Time (MP L/T):
• 8~10 Days