| FR-4, is a widely acceptable international grade desination for fiberglass
reinforced epoxy laminated that are flame retardant (self extinguishing). After
add copper layer on one or each side FR4, it become to Copper Clad Laminate
(CCL), and this is the non-conductive core materail for normal printed cricuit
board (PCB). Printed circuit board using FR4 as core material will be named as
"FR4 PCB".PCB is used to mechanically support and electrically connect electronic
components using conductive pathways, tracks or signal traces etched from copper
clad laminate substrate. Sometimes, PCB also named Printed Wiring Board (PWB) or
etching wiring board if no extra electronic components was added on. |
| 1. Single-Sided PCB |
| A single-sided PCB has only one layer of conductive copper. Electronic components
are mounted on this one layer. It is the simplest and cheapest type of PCB,
commonly
used in simple electronic devices like calculators and sensors. |
| 2. Double-Sided PCB |
| A double-sided PCB has two layers of conductive copper, with components mounted
on
both sides of the board. Electrical connections between the layers are made
through
vias (plated-through holes). This type is suitable for moderately complex
circuits
such as industrial controls and power supplies. |
| 3. Multi-Layer PCB |
| Multi-Layer PCBs consist of three or more
layers of conductive copper separated by
insulating layers. The layers are interconnected by blind vias, buried vias, and
through vias. These PCBs are used in complex electronic devices like computer
motherboards and communication equipment, providing higher circuit density and
functionality. |
| 4. Rigid-Flexible Circuits |
| Rigid-flex circuits combine the features of both rigid
and flexible PCBs. Parts of the board are rigid, while other parts are flexible,
allowing the board to bend and fold during installation. This design is used in
applications requiring high-density assembly and 3D configurations, such as
mobile
devices and aerospace electronics. |
| 5. Heavy Copper PCB |
| Heavy copper PCBs use thicker copper layers
(typically over 3 oz/ft²), providing
higher current carrying capacity and better heat dissipation. They are commonly
used
in high-power electronics, power converters, and automotive electronics. |
| 6. HDI PCB (High-Density Interconnect
PCB) |
| HDI PCBs have higher wiring density, finer lines and
spaces, and smaller vias. They
use laser drilling technology and feature microvias, blind vias, and buried
vias.
These PCBs are used in high-performance computing, smartphones, and other
advanced
electronic devices, offering higher performance and smaller sizes. |
| 7. High Tg PCB |
| High Tg PCBs use materials with a higher glass transition temperature (Tg),
maintaining stable mechanical and electrical properties at elevated
temperatures.
They are suitable for applications in high-temperature environments such as
automotive electronics and industrial equipment. |
| 8. Extra Thin PCB |
| Extra thin PCBs typically have a thickness of less than 0.8 mm, making them
suitable
for applications with space constraints. These PCBs are common in consumer
electronics such as smart cards and wearable devices due to their lightweight
and
flexibility. |
| 9. RF Board |
| RF boards are designed for high-frequency signal transmission and use materials
with
low loss and high dielectric constant to ensure signal integrity and stability.
They
are widely used in wireless communication devices, satellites, and radar
systems. |
| 10、FR4 PCB Technics Capacity |
|
No. |
Item |
Description |
DataSheet |
|
1 |
Max Layer Count |
Layer |
32 Layer |
|
2 |
Min Board Thickness |
mm |
0.13mm |
|
3 |
Max Board Thickness |
mm |
≥8mm |
|
4 |
Max Board Dimension |
mm |
24*24"" (610*610mm)
4*51""(100*1,300mm) |
|
5 |
Max Conductor Thickness |
OZ |
20OZ |
|
6 |
Min Conductor Thickness |
OZ |
1/2 OZ |
|
7 |
Min Trace Width/Space |
mil |
Normal: 3/3 mil
HDI: 2/2 mil |
|
8 |
Min Punch Hole Dia |
mm |
2.5mm |
|
9 |
Min Hole Spacing |
mm |
0.3mm |
|
10 |
Max Aspect Ratio |
rate |
8：1 |
|
11 |
Min Solder PAD Dia |
mm |
Normal: 0.35mm |
|
12 |
Min PAD Ring(Single) |
mm |
3mil (0.075mm)
6mil (0.15mm)
8mil (0.2mm) |
|
13 |
PTH Wall Thickness |
um |
12um for HDI;
15um for normal |
|
14 |
PTH Dia Tolerance |
mil |
± 3 mil |
|
15 |
NPTH Dia Tolerance |
mil |
±2 mil |
|
16 |
Hole Position |
mil |
±2 mil |
|
17 |
Outline Tolerance |
mm |
CNC: ± 0.15mm |
|
18 |
|
mm |
Die Punch: ±0.1mm |
|
19 |
Min Soldermask Bridge |
mil |
HDI: 6 mil ;
Normal: 8mil |
|
20 |
Min BAG PAD Margin |
mil |
5 mil |
|
21 |
Impedance Controlled |
|
Value>50 ohm: ± 10%
Value≤50 Ohm: ± 5 Ohm |
|
22 |
Thermal Conductivity
(W/m.K, or W/m.C) |
|
0.30-0.45 |
|
23 |
Dielectric Strength |
|
> 1.3 KV /mm |
|
24 |
Wrap & Twist |
|
≤ 0.75% |
|
25 |
Flammability |
|
94V-0 |
|
26 |
Thermal Stress |
|
3 x 10 Sec @ 280 ℃ |
|
27 |
Surface Treatment |
|
ENIG, Flash Gold, Hard Gold Finger,
Gold Plating(50mil), Gold finger,
Selected Gold plating,ENEPIG, ENIPIG;
HAL, HASL(LF), OSP, Silver Imm., Tin Imm |
|
| Please contact us for more information about
the
FR4 Printed Circuits |
