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Tg Definition:

Tg stands for Glass Transition Temperature. As printed circuit boards (PCBs) are classified as V-0 (UL 94-V0) for flammability, if the temperature exceeds the designated Tg value, the board will transition from a glassy state to a rubbery state, thereby affecting the PCB's functionality.

High Tg PCB

High Tg PCB
Working Temperature Considerations:

If your product's operating temperature is higher than normal (130-140°C), you need to use high Tg material, which is >170°C. Common high Tg values for PCBs are 170°C, 175°C, and 180°C. Typically, the PCB Tg value should be at least 10-20°C higher than the product's working temperature. For example, if you use a 130 Tg board, the working temperature should be lower than 110°C; for a 170 Tg board, the maximum working temperature should be lower than 150°C.

Differences Between Tg 130 and Tg 170:

To understand the differences between Tg 130 and Tg 170, please continue reading. Additionally, we have provided specifications for Tg 150 and Tg 170 to help customers better understand high Tg materials. For more information, read the comparisons: Tg 150 vs. Tg 170.

Popular High Tg Board Materials:
Here are some popular high Tg board materials available in the market:
  • S1170 & S1000-2: SYL (Shengyi Technology)
  • FR406, FR408, IS410 & DS370HR: Isola
  • MCL-E-679: Hitachi
  • N4000-6 & N4000-11: Nelco

There are many different high Tg materials not listed here. Different countries and companies may prefer different materials. Please refer to the datasheets for each material to choose the most suitable one for your needs. If not specified, we typically use S1170 from SYL.

High Tg Materials in the LED Industry:

170 Tg raw materials are also popular in the LED industry because the heat dissipation of LEDs is higher than that of normal electronic components. The same structure of FR4 boards is much cheaper than MCPCBs or Ceramic boards. The normal Tg value of MCPCBs is the same as standard FR4 PCBs, at 130-140°C. Customers can also request high Tg (170-180°C) for MCPCBs, but the thermal conductivity will only be (0.3-0.4 W/m.K).

For Extremely High Temperatures:

If the PCB's working temperature is higher than 170/180°C, such as 200°C, 280°C, or even higher, it is advisable to use a Ceramic board, which can withstand temperatures ranging from -55°C to 880°C.

High Frequency PCB Technics Capacity
No.
Item
Description
DataSheet
1
Rogers Material
RO3000 Series
RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210
2
Rogers Material
RO4000 Series
RO4003C, RO4350B, RO4360, RO4533, RO4700, RO4835
3
Rogers Material
RT5000 Series
RT5870, RT5880
4
Rogers Material
RT6000 Series
RT6002, RT6035, RT6006
5
Rogers PP
Semi-cured adhesive
RO4403(4mil), RO4450B(4mil), RO4450F(4mil), RO3001(1.5mil), RO2929
6
Arlon Material
Arlon Series
Diclad, Cuclad, Isoclad, AD Series, CLTE eles
7
Arlon PP
Semi-cured adhesive
25FR 1080(4mil), 25FR 2112(6mil), Cuclad6700(1.5mil)
8
Taconic Material
Taconic Series
TLX, TLY, RF, TLC, TLG Series, CER10 eles
9
Taconic PP
Semi-cured adhesive
TP-32(4mil), TPG(4mil), HT1.5(1.5mil)
10
Wangling Material
Wangling
F4BK, F4BM, F4B, TP-1/2, TF-1/2, CT330, CT350, CT440, CT615
11
Finish copper thickness
OZ
0.50Z-120Z
12
Material copper thickness
OZ
0.50z-10Z
13
Min finish board size
All Material
0.5*1.0mm
14
The number of layers
1-70layers
15
High Frequerncy mixed pressure layers
4-70layers
16
Material mixed pressure
Variety
Rogers/Taconic/Arlon/Wanglin and FR-4
17
Min core thickness
mil
4mil
18
Max finish board size
RO3000 Series
590*440mm(Single/Double Side), 580*420mm(Multi-layers)
RO4000 Series
1200*430mm(Single/Double Side), 880*600mm(Multi-layers)
RT5000 Series
590*440mm(Single/Double Side), 580*420mm(Multi-layers)
RT6000 Series
590*440mm(Single/Double Side), 580*420mm(Multi-layers)
F4BM Series
1480*430mm(Single/Double Side)
TP/TF Series
180mm*180mm(Single/Double Side)
CT Series
1200*430mm(Single/Double Side), 880*600mm(Multi-layers)
19
Max PTFE array size(thicknesss 0.50mm)
mm
16*18
20
Finish board thickness
mm
0.13-8.0mm(Double Side) 0.4-8.0mm(Multi-Layers)
21
Min PTFE material hole size
mm
0.35
22
Dielectric constant
Range
1-25
23
Material thickness tolerance
mm
±0.05mm
24
Finish board thickness tolerance
mm
Board thickness≤1.0mm:±0.1, Board thickness>1.0mm:±10%
25
Min Pattern Width tolerance
um
±20um
26
Min Pattern Width/Spacing
mm
0.076mm
Please contact us for more information about Hi Tg circuit board.