RF boards, or Radio Frequency Printed Circuit Boards, are designed specifically for applications operating at high frequencies, typically between 300 MHz to 3 GHz or even higher. Standard FR4 boards cannot meet the stringent requirements for high-frequency performance, necessitating the use of special materials to achieve optimal performance.

RF boards excel in high-frequency performance due to their low dielectric tolerance and material loss. They are ideal for applications where precise signal transmission and minimal loss are critical.

• Currently, the following materials are commonly used for RF boards:
• Rogers High-Frequency Circuit Materials: These include variants like RO4233, RO4350, RO4003, etc., with copper thickness ranging from 1/4 OZ to 2 OZ. These materials are renowned for their excellent high-frequency characteristics.
• PTFE (Dupon Telfon): Known for its low dielectric constant and loss tangent, PTFE is suitable for high-frequency applications where signal integrity is paramount.

While the fabrication process is similar to that of FR4 boards, RF boards require more intricate copper plating due to the characteristics of the materials used. Metalizing through-holes (copper plating) is more challenging, and other processes are more complex compared to FR4. Therefore, specialized handling methods and experienced workers are essential for producing high-quality RF boards.

RF boards play a crucial role in modern electronics, enabling reliable high-frequency signal transmission. Their use of specialized materials and fabrication processes ensures optimal performance in demanding applications across various industries.

• Material:
• Rogers/Teflon
• Board Thickness:
• 0.5mm~3.0mm (0.02"~0.12")
• Copper Thickness:
• 0.5 oz, 1.0 oz, 2.0 oz, 3.0 oz
• Outline:
• Routing, punching, V-Cut
• Soldermask:
• White, Black, Blue, Green, Red Oil
• Legend/Silkscreen Color:
• Black, White
• Surface Finishing:
• Immersion Gold, HASL, OSP
• Max Panel Size:
• 600*500mm (23.62"*19.68")
• Packing:
• Vacuum/Plastic bag
• Samples Lead Time (L/T):
• 7~9 Days
• Mass Production Lead Time (MP L/T):
• 8~10 Days