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High Density Interconnects (HDI) boards are defined as PCBs with a higher wiring
density per unit area compared to traditional printed circuit boards. They
feature finer lines and spaces (less than 100 µm), smaller vias (less than 150
µm), smaller capture pads (less than 400 µm), I/O counts greater than 300, and a
higher connection pad density (greater than 20 pads/cm²) than those found in
conventional PCB technology. HDI boards are utilized to reduce size and weight
while enhancing electrical performance.
Based on the layer configuration, HDI boards are currently categorized into
three basic types:
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HDI PCB (1+N+1)
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- Features:
- Ideal for BGAs with lower I/O counts
- Capable of fine lines, microvias, and precise registration
technologies,
supporting
- 0.4 mm ball pitch
- Qualified materials and surface treatments suitable for lead-free
processes
- Excellent stability and reliability during mounting
- Copper-filled vias
- Applications:
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Cell phones, UMPCs, MP3 players, PMPs, GPS
devices, memory cards
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HDI PCB (2+N+2)
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- Features:
- Suitable for BGAs with smaller ball pitch and higher I/O counts
- Increases routing density for complex designs
- Thin board capabilities
- Low Dk / Df materials for improved signal transmission performance
- Copper-filled vias
- Applications:
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Cell phones, PDAs, UMPCs, portable game consoles, digital still cameras
(DSCs), camcorders
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ELIC (Every Layer Interconnection)
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- Features:
- Every layer via structure maximizes design flexibility
- Copper-filled vias offer enhanced reliability
- Superior electrical performance
- Cu bump and metal paste technologies enable extremely thin boards
- Applications:
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Cell phones, UMPCs, MP3 players, PMPs, GPS devices, memory cards
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HDI PCB Technics Capacity
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No.
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Item
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Description
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DataSheet
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1
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Material |
Brand
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SY、ITEQ、KB、NOUYA |
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2
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HDI Construction |
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1+N+1、2+N+2、3+N+3、4+N+4、5+N+5、6+N+6、Anylayer |
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3
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Construction order |
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N+N、N+X+N、1+(N+X+N)+1 |
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4
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Layer |
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1-40Layers |
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5
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Min Pattern Width/Spacing |
mil
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2/2 |
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6
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Min Mechanical Hole |
mm
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0.15mm |
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7
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Min Thickness of Core Board |
mil
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2mil |
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8
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Laser Hole |
mm
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0.075mm-0.1mm |
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9
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Min thickness of PP |
mil
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2mil |
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10
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Max diameter of resin plug hole |
mm
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0.4mm |
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11
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Electroplating to fill holes |
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Can do it |
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12
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Electroplating to fill holes size |
mil
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3-5mil |
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13
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hole pile pad/hole pile hole/pad hole(VOP) |
mil
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Can do it. |
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14
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The distance from the wall of via hole to the pattern |
mil
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7 mil |
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15
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Laser drilling hole accuracy |
mm
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0.025mm |
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16
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Min BGA pad center distance |
mm
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0.3mm |
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17
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Min SMT |
mm
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0.25mm |
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18
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Plating hole-filling sag |
um
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≤10um |
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19
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Back drilled/countersink hole tolerance |
mm
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±0.05mm |
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20
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Through-hole plating penetration capacity |
Rate
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16:1 |
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21
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Blind hole plating penetration capacity |
Rate
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1.2:1 |
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22
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BGA min PAD |
mm
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0.2mm |
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23
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Min Buried Hole(Mechanical Hole) |
mm
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0.2mm |
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24
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Min Buried Hole(Laser Hole) |
mm
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0.1mm |
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25
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Min Blind Hole(Laser Hole) |
mm
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0.1mm |
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26
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Min Blind Hole(Mechanical Hole) |
mm
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0.2mm |
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27
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Minimum spacing between laser blind hole and mechanical buried hole
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mm
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0.2mm |
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28
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Min Laser Hole |
mm
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0.10(depth≤55um)、0.13(depth≤100um) |
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29
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MinBGA pad center distance |
mm
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0.3mm |
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30
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Interlaminar alignment |
mm
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±0.05mm(±0.002") |
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