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Metal Core PCB refers to a printed circuit board where the core material is metal, unlike the typical FR4 or CEM1-3.

The most commonly used metals for MCPCBs are aluminum, copper, and steel alloy. Aluminum is popular due to its excellent heat transfer and dissipation properties while being relatively cost-effective. Copper provides superior performance but is more expensive. Steel, including normal and stainless steel, is more rigid but has lower thermal conductivity compared to aluminum and copper. The choice of core material depends on the specific application requirements.

Typically, aluminum is the most economical option considering thermal conductivity, rigidity, and cost. Therefore, most standard Metal Core PCBs use aluminum as the base material. In our company, unless otherwise specified, the term metal core refers to aluminum, making MCPCB synonymous with Aluminum Core PCB. For Copper Core PCB, Steel Core PCB, or Stainless Steel Core PCB, special instructions must be included in the design specifications. The term "MCPCB" is often used as an abbreviation for Metal Core PCB or Metal Core Printed Circuit Board. Different terminology might be used to refer to the core or base material, leading to various names such as Metal PCB, Metal Base PCB, Metal Backed PCB, Metal Clad PCB, and Metal Core Board.

MCPCBs are preferred over traditional FR4 or CEM3 PCBs for their superior heat dissipation capabilities. This is due to the presence of a thermally conductive dielectric layer. The main difference between an FR4 board and an MCPCB is this thermally conductive dielectric material, which acts as a thermal bridge between the IC components and the metal backing plate. Heat is conducted from the components through the metal core to an external heat sink. In contrast, FR4 boards trap heat if it is not dissipated by a surface heatsink. Lab tests show that a 1W LED on an MCPCB maintains a temperature close to ambient (25°C), whereas the same LED on an FR4 board heats up to 12°C above ambient. LED PCBs are usually made with an aluminum core, but steel core PCBs are also occasionally used.

Metal Core PCB

Metal Core PCB
Advantage of MCPCB
  • Heat Dissipation: LEDs can generate between 2-5W of heat, and if this heat is not efficiently dissipated, it can cause the LEDs to fail. Heat buildup can decrease a LED’s light output and cause it to degrade. MCPCBs are designed to effectively remove heat from all surface-mounted ICs, not just LEDs. The aluminum base and the thermally conductive dielectric layer serve as a bridge between the ICs and the heat sink. A single heat sink can be mounted directly to the aluminum base, eliminating the need for multiple heat sinks on the surface-mounted components.
  • Thermal Expansion: Thermal expansion and contraction are natural properties of materials. Different materials have different coefficients of thermal expansion (CTE). Aluminum and copper have advantages over normal FR4 due to their better thermal conductivity, which ranges from 0.8 to 3.0 W/c.K.
  • Dimensional Stability: Metal-based PCBs are more dimensionally stable than those made from insulating materials. For instance, when an aluminum PCB and aluminum sandwich panels are heated from 30°C to 140-150°C, their size changes by only 2.5 to 3.0%.
MCPCB Technics Capacity
No.
Item
Description
DataSheet
1
Max Layer Count
Layer
10 Layers
2
Min Board Thickness
mm
0.3mm
3
Max Board Thickness
mm
4.0mm
4
Max Board Dimension
mm
610*1,625mm
5
Max Conductor Thickness
OZ
10 OZ
6
Min Conductor Thickness
OZ
1/2 OZ
7
Min Trace Width/Space
mil
6/6 mil
8
Min Hole Diameter
mm
0.3mm
9
Min Punch Hole Dia
mm
3.0mm
10
Min Hole Spacing
mm
0.4mm
11
Max Aspect Ratio
rate
12:1
12
Min Solder PAD Dia
mm
0.35mm
13
Min PAD Ring(Single)
3mil (0.075mm);
6mil (0.15mm);
8mil (0.2mm);
14
PTH Wall Thickness
um
12 um for HDI;
15um for normal
15
PTH Dia Tolerance
mil
± 3 mil
16
NPTH Dia Tolerance
mil
± 2 mil
17
Hole Position
mil
±3 mil 
18
Outline Tolerance
mil
CNC: ± 6 mil
mil
Die Punch: ± 6 mil
19
Min Soldermask Bridge
mil
8 mil
20
Min BAG PAD Margin
mil
5 mil
21
Impedance Controlled
N/M
22
Thermal Conductivity
(W/m.K, or W/m.C)
Normal: 0.8~1.0, 1.5
High: 2.0, 3.0
23
Dielectric Strength
>1.5 Kv (L/S >1.5mm);
>3.0 Kv (L/S >3.0mm)
24
Wrap & Twist
≤ 0.75%
25
Flammability
94V-0
26
Thermal Stress
3 x 10 Sec @ 280 ℃
27
Surface Treatment
ENIG, Flash Gold, Hard Gold Finger,
Gold Plating(50mil), Gold finger,
Selected Gold plating, ENEPIG, ENIPIG;
HAL, HASL(LF), OSP, Silver Imm., Tin Imm
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