Apart from MCPCB, if your application requires high pressure, high insulation, high frequency, high temperature, and high reliability in small electronic products, Ceramic PCBs are an excellent choice.

Why do Ceramic PCBs perform so well? Let's look at their basic structure to understand.

• Base Material: 96% or 98% Alumina (Al2O3), Aluminum Nitride (ALN), or Beryllium Oxide (BeO)
• Conductive Material: For thin and thick film technology, the conductors are typically silver palladium (AgPd) or gold palladium (AuPd). For Direct Copper Bonded (DCB) technology, copper is used.
• Application Temperature Range: -55°C to 850°C
• Thermal Conductivity: 24W-28W/m-K for Al2O3, 150W-240W/m-K for ALN, and 220W-250W/m-K for BeO
• Maximum Compression Strength: Greater than 7,000 N/cm²
• Breakdown Voltage: 15/20/28 KV/mm for thicknesses of 0.25mm, 0.63mm, and 1.0mm respectively
• Thermal Expansion Coefficient: 7.4 ppm/K (within the range of 50°C to 200°C)